About us

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Company Overview

  • Company name
    Korea Instrument Co., Ltd.
    CEO
    Sung-Tak Oh
    Establishment
    1996. 06. 14
    Business
    Probe Cards for Wafer EDS, AMB
    Employees
    350
    Address
    9-29 Dongtansandan 4-gil, Hwaseong-si, Gyeonggi-do, Korea

CEO Message

Today, in the semiconductor industry, precision and reliability are not options —they are essential requirements.
At Korea Instrument, we specialize in advanced probe card solutions that enable our valued customers to achieve higher yield,greater accuracy, and faster time-to-market.

Our mission is simple: to be a trusted partner that supports our customers’ success through consistent quality, engineering excellence, and reliable execution.

As semiconductor devices continue to increase in complexity—driven by advancements in AI, automotive electronics, and high-performance computing—testing requirements are becoming ever more demanding. In response, we continuously invest in advanced R&D, strengthen our manufacturing capabilities, and work closely with our customers as an extended one team.

We believe that long-term partnerships are built on performance, transparency, and accountability. Guided by these principles, Korea Instrument remains committed to delivering reliable solutions that support semiconductor industry in driving digital transformation for a more convenient and better future.

Thank you for your trust and support.

Korea Instrument Co., Ltd
CEO
Oh, Sung Tak

Vision

“Leading the global standard of semiconductor testing
with relentless technological innovation and uncompromising quality.”

Mission

“We deliver best-in-class probe card solutions on time,
based on uncompromising quality and manufacturing excellence,
enabling our customers to enhance productivity and strengthen their global competitiveness.”

Core Value

  • Quality First

  • Manufacturing Excellence

  • Technology Leadership

  • Collaboration & Accountability

Our Core Technologies

  • Design

    Expertise in Mechanical & Electrical Design

    PCB / MLC / MLO Design

    MEMS Probe & Structure Design

    Electrical Simulation (SI/PI)

    Structural Analysis (Static / Dynamic)

    Electro-Thermal Analysis (Joule Heating)

  • MEMS

    In-House MEMS Process Line

    Advanced MEMS Materials

    MEMS Probe Fabrication (Micro-Cantilever, Vertical)

    Ultra-precision Geometry Realization

  • Automated Assembly

    Ultra-Precision Automatic Micro-Cantilever Bonding MEMS Vertical Probe Insertion

  • Customer Service

    Repair services

    Root Cause Analysis & Technical Support