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Void Free AMB Substrate

KI is world first AMB manufacturer who achieved mass production from 2022.

KI's special process make AMB void free in interface between Copper and ceramic.

KI AMB has been widely applied on EV power module & Satellite power module, because of its very extremely high reliability.

Application
Power Modules for xEV, renewable energy, aerospace
Features
Void Free in interface between copper and ceramic
Thermal Shock Test : 3000 Cycles
Test Condition : -55~150℃, 30 min/cycle, Total 1500 Hours
Major reference
EV Power module : German EV power module
Satellite Power module : China Satellite
Industrial Power module : Littelfuse TO-247 (ISO-247), SMPD

Void Free Picture

Data sheet

Product STC Substrates AMB Substrates
Ceramic materials Al2O3 AlN-170 AlN-130 AlN-170 Si3N4
Raw Materials Ceramic thickness (mm) 0.25 / 0.38 / 0.635 / 1.0 0.38 / 0.635 0.25 / 0.38 / 0.635 / 1.0 0.25 / 0.32
Cu thickness (mm) 0.006~0.3 0.127 / 0.3 / 0.4 / 0.5 / 0.8
Thermal CTE ppm/K @ 20°C - 400°C 6.7 4.6 4.6 4.6 2.6
Thermal conductivity W/mK @ 25°C 24 180 130 180 85
Mechanical Bending strength MPa 400 450 650 450 800
Fracture toughness MPa・√m 3.0 3.0 2.4 3.0 6.5
Electrical Breakdown strength kV/mm (DC) >15 >15 >15 >15 >15
Electrical resistivity Ω·cm @ 25℃ >1014 >1014 >1014 >1014 >1014